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Flexible thermal interface material replaces traditional thermal pads between the circuit board and the heatsink. It fills gaps of 0.2–3.0 mm, is electrically non-conductive, and is easy to apply without curing.

• Non-conductive thermal paste to replace pads
• Fills gaps from 0.2 to 3.0 mm precisely
• No curing required, ready to use
• Minimize the risk of pump-out phenomenon